Printed Circuit Board Assembly Service
Leave the assembly of high-density and fine components to our advanced implementation line.
Our company has the capability to eliminate outflow defects through image inspection and functional testing in the implementation of ultra-small components and high-density substrates, ensuring stable quality and a quick response to delivery times. We flexibly accommodate production from small quantities of diverse products to mass production. We provide products that meet your quality standards, from 0603 size chip components to narrow pitch BGA components. 【Surface Mount Line】 ■ Lead-free solder line: YSi-12, YS100, YS24, HSD-Xg, etc. ■ Lead-free solder line: AE07-8-40ELF, YV88Xg, YV100Xg, etc. ■ Eutectic solder line: AIS-20-62C, YVL88II, YV100X, HSD-X, etc. *For more details, please download the PDF or contact us.
- Company：明和電機
- Price：Other
